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BOYD

HEAT SINK BGA COPPER TOP MOUNT 80MM X 80MM X 12MM

342949
2650727

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The square skived fin series is a board-level heat sink solution specifically designed for efficient cooling of BGA and FPGA devices. Featuring a copper top-mount design, this heat sink offers excellent thermal conductivity for effective heat dissipation. With dimensions of 80mm x 80mm x 12mm, it is compact yet robust, making it ideal for high-performance electronic systems where reliable cooling is essential.
boyd-342949_Datasheet1
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Product Overview

Product ID:
2650727
Manufacturer Part Number:
342949
Brand/Manufacturer
BOYD
Unit of Measure:
PCS

Specification

Depth:
12 mm
Height:
80 mm
Width:
80 mm

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BOYD
HEAT SINK BGA COPPER TOP MOUNT 80MM X 80MM X 12MM
MPN Part #: 342949
Product ID: 2650727
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