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	HEAT SINK BGA COPPER TOP MOUNT 80MM X 80MM X 12MM Product ID: 2650727 Manufacturing MPN: 342949
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Short Description	HEAT SINK BGA COPPER TOP MOUNT 80MM X 80MM X 12MM
Long Description	The square skived fin series is a board-level heat sink solution specifically designed for efficient cooling of BGA and FPGA devices. Featuring a copper top-mount design, this heat sink offers excellent thermal conductivity for effective heat dissipation. With dimensions of 80mm x 80mm x 12mm, it is compact yet robust, making it ideal for high-performance electronic systems where reliable cooling is essential.
Brand/Manufacturer Name	BOYD
Manufacturing Part Number	342949
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